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14-layer AI Edge Computing Board

1.Number of layers：14L

2.Plate thickness：3.2mm

3.Material：IT170GRA1(Hi-Tg170°C)

4.Surface treatment：immersion gold 0.05um

5.Mini line width/line spacing：100/100μm

6.Mini hole diameter：0.2mm

7.Special process：

  1. 1.POFV process

  2. 2.Press-fit Hole

     3.Aspect ratio 16:1

     4.Back Drilling

     5.Asymmetric Inner Layer Copper Thickness Process

Previous : High-End 62-Layer Load Board (93K) Next : 10-layer 4-step DUT Board
14-layer AI Edge Computing Board
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