PCB
1.Number of floors：16L
2.board thickness：2.6mm
3.Material：TU-862 HF
4.Surface treatment：gold deposit
5.Min line width/line spacing：75/75μm
6.Min hole diameter：0.25mm
7.Special processes：
Design of cathode and anode copper
POFV Process
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：Room 306,A4 Building,3rd Industrial Zone,Huaide,Fuyong Street,Bao'an District,Shenzhen,China
： A1 Building,Ditang Industrail B zone,Shajing Street,Bao'an District,Shenzhen, China
：+86 13244860273
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