1.Layer count: 44 layers
2.Material: HTG FR4
3.Board thickness: 6.35 mm
4.Min. hole size: 0.2 mm
5.Surface Treatment：Thin Gold Plating + Selective Hard Gold Plating
6.Process:
Aspect ratio: 32:1
BGA Spacing：0.65mm
Warpage：0.10%
DUT Flatness：50μm
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