16-Layer On board system

1.Number of layers:16L
2.Plate thickness:2.2mm
3.Material:TU-862HF
4.Surface treatment:OSP + immersion gold
5.Minimum line width/line spacing:60/60μm
6.Minimum hole diameter:0.25mm
7.Special process:
1.POFV process
2.Plasma degumming

16-Layer On board system
1.Number of layers:16L
2.Plate thickness:2.2mm
3.Material:TU-862HF
4.Surface treatment:OSP + immersion gold
5.Minimum line width/line spacing:60/60μm
6.Minimum hole diameter:0.25mm
7.Special process:
1.POFV process
2.Plasma degumming
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