PCB

 

Low-Earth orbit satellite communication equipment

1.Number of layers: 27-Layer 2nd-order HDI
2.Plate thickness: 3.94mm
3.Material: Panasonic MEG6
4.Surface treatment: immersion gold plating
5.Minimum line width/line spacing: 75/75μm
6.Minimum hole diameter: 0.25mm
7.Special process:
1.Yin-yang copper design
2.POFV process
3.Laser-cut copper window design
4.Core pressing against Core
5.Aspect ratio 15.76:1

Low-Earth orbit satellite communication equipment
1.Number of layers: 27-Layer 2nd-order HDI
2.Plate thickness: 3.94mm
3.Material: Panasonic MEG6
4.Surface treatment: immersion gold plating
5.Minimum line width/line spacing: 75/75μm
6.Minimum hole diameter: 0.25mm
7.Special process:
1.Yin-yang copper design
2.POFV process
3.Laser-cut copper window design
4.Core pressing against Core
5.Aspect ratio 15.76:1
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Room 306,A4 Building,3rd Industrial Zone,Huaide,Fuyong Street,Bao'an District,Shenzhen,China

 Sales@sunkeypcb.com       Ali@sunkeypcb.com  

: A1 Building,Ditang Industrail B zone,Shajing Street,Bao'an District,Shenzhen, China   

+86 13244860273

                                                                                  


 

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