PCB
1.Number of floors:14L
2.Plate thickness:2.6mm
3.Material:TU-862HF
4.Surface treatment:OSP+gold deposit
5.Minimum line width/line spacing:75/75μm
6.Minimum hole diameter:0.25mm
7.Special processes:
1.Design of male and female copper of core layer
2.Plasma process
3.Aspect ratio 10.4:1

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