High-Speed & High-Frequency Solutions

For application scenarios including data centers, servers and 5G communications, SunKey delivers mature high-speed and high-frequency PCB manufacturing capabilities

Optical Module PCB (400G/800G Coverage)

Technical Capabilities: We utilize ultra-low loss substrates to realize advanced high-density interconnection (HDI), with impedance tolerance stably controlled within ±5%, ensuring superior signal transmission performance

Server & Communication Equipment PCB

Technical Capabilities:Capable of 30-layer constructions and any-order interconnection design. Possess mature mass production experience in sophisticated processes such as 16:1 high aspect ratio, backdrilling and resin plugging     

Semiconductor & Test Solutions

For chip R&D, verification and final testing stages, SunKey provides high-precision and high-reliability PCB solutions.

Semiconductor Test Boards:Focused on wafer-level and finished chip testing. We are capable of manufacturing 20-layer, 5.0mm ultra-thick boards and adopt special processes such as 50μ' thick gold plating to ensure testing accuracy and long service life.

Chip Verification & SI Test Boards:Providing verification accelerator card PCB for AI chips, HPC and other high-speed chips. Combined with Signal Integrity (SI) analysis, we offer high-precision test boards featuring minimum line width and spacing of 0.07 mm

Special Processes & Applications

SunKey also has corresponding technical solutions to meet the demands of emerging sectors and special structure requirements

Rigid-Flex PCB

Application Fields: Suitable for products with special requirements for space, weight and reliability, such as infrared thermal imaging and high-speed image acquisition equipment.

High-Precision Test Boards / Millimeter-Wave Radar PCB

Technical Capabilities:Achievable minimum line width and spacing of 0.07 mm, meeting requirements for high-precision patterns and signal control in high-frequency testing, automotive millimeter-wave radar and other fields